Vertical 4-way shared pixel in a single column with internal reset and no row select

ABSTRACT

A method and apparatus for reducing space and pixel circuit complexity by using a 4-way shared vertically aligned pixels in a same column. The at least four pixels in the pixel circuit share a reset transistor and a source follower transistor, can have a plurality of same colored pixels and a plurality of colors, but do not include a row select transistor.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments described herein relate generally to improved semiconductorimaging devices and in particular to imaging devices having an array ofpixels and to methods of operating the pixels to reduce temporal noise.

2. Background of the Invention

A conventional four transistor (4T) circuit for a pixel 150 in a pixelarray 230 of a CMOS imager is illustrated in FIG. 1. The 4T pixel 150has a photosensor such as a photodiode 162, a reset transistor 184, atransfer transistor 190, a source follower transistor 186, and a rowselect transistor 188. It should be understood that FIG. 1 shows thecircuitry for operation of a single pixel 150, and that in practicaluse, there will be an M×N array of pixels arranged in rows and columnswith the pixels of the array 230 being accessed using row and columnselect circuitry, as described in more detail below.

The photodiode 162 converts incident photons to electrons, which areselectively passed to a floating diffusion region A through the transfertransistor 190 when activated by a TX1 control signal. The sourcefollower transistor 186 has its gate connected to floating diffusionregion A and thus amplifies the signal appearing at the floatingdiffusion region A. When a particular row containing pixel 150 isselected by an activated row select transistor 188, the signal amplifiedby the source follower transistor 186 is passed on a column line 170 tocolumn readout circuitry (242, FIGS. 2-4). The photodiode 162accumulates a photo-generated charge in a doped region of its substrateduring a charge integration period. It should be understood that thepixel 150 may include a photogate or other photon to charge convertingdevice, in lieu of a photodiode, as the initial accumulator forphoto-generated charge.

The gate of transfer transistor 190 is coupled to a transfer controlsignal line 191 for receiving the TX1 control signal, thereby serving tocontrol the coupling of the photodiode 162 to region A. A voltage sourceVpix is selectively coupled through reset transistor 184 and conductiveline 163 to floating diffusion region A. The gate of the resettransistor 184 is coupled to a reset control line 183 for receiving aRST control signal to control the reset operation in which the voltagesource Vpix is connected to floating diffusion region A.

A row select signal (Row Sel) on a row select control line 160 is usedto activate the row select transistor 188. Although not shown, the rowselect control line 160, reset control line 183, and transfer signalcontrol line 191 are coupled to all of the pixels of the same row of thearray. The voltage source Vpix is coupled to transistors 184 and 186 byconductive line 195. The column line 170 is coupled to the output of allof the pixels of the same column of the array and typically has acurrent sink 176 at one end. Signals from the pixel 150 are selectivelycoupled to a column readout circuit 242 (FIGS. 2-4) through the columnline 170.

As is known in the art, a value can be read from pixel 150 in a two stepcorrelated double sampling process. First, floating diffusion region Ais reset by activating the reset transistor 184. The reset signal (e.g.,Vrst) found at floating diffusion region A is readout to column line 170via the source follower transistor 186 and the activated row selecttransistor 188. During a charge integration period, photodiode 162produces charge from incident light. This is also known as the imageintergration period. After the integration period, the transfertransistor 190 is activated and the charge from the photodiode 162 ispassed through the transfer transistor 190 to floating diffusion regionA, where the charge is amplified by the source follower transistor 186and passed to the column line 170 (through the row select transistor188) as an integrated charge signal Vsig. In some instances, the resetsignal Vrst is provided after the integrated charge signal Vsig. As aresult, two different voltage signals—the reset signal Vrst and theintegrated charge signal Vsig—are readout from the pixel 150 onto thecolumn line 170 and to column readout circuitry 242, where each signalis sampled and held for further processing as is known in the art.Typically, all pixels in a row are readout simultaneously ontorespective column lines 170 and the column lines may be activated insequence or in parallel for pixel reset and signal voltage readout.

FIG. 2 shows an example CMOS imager device 201 that includes the pixelarray 230 and a timing and control circuit 232, which provides timingand control signals to enable reading out of signals stored in thepixels in a manner commonly known to those skilled in the art. Examplearrays have dimensions of M×N pixels, with the size of the array 230depending on a particular application. In the illustrated imager device201, the pixel signals from the array 230 are readout a row at a timeusing a column parallel readout architecture. The controller 232 selectsa particular row of pixels in the array 230 by controlling the operationof row addressing circuit 234 and row drivers 240. Reset Vrst and imageVsig signals in the selected row of pixels are provided on the columnlines 170 to a column readout circuit 242 in the manner described above.The signals read from each of the columns can be readout sequentially orin parallel using a column addressing circuit 244. Pixel signals (Vrst,Vsig) corresponding to the readout reset signal and integrated chargesignal are provided as respective outputs Vout1, Vout2 of the columnreadout circuit 242 where they are subtracted in differential amplifier246, digitized by analog-to-digital converter (ADC) 248, and sent to animage processor circuit 250 for image processing.

FIG. 3 shows more details of one example of the arrangement of the rowsand columns 249 of pixels 150 in the array 230. Each column 249 includesmultiple rows of pixels 150. Signals from the pixels 150 in a particularcolumn 249 can be readout to sample and hold circuitry 261 associatedwith the column 249 (part of circuit 242) for acquiring the pixel resetVrst and integrated charge Vsig signals. Signals stored in the sampleand hold circuits 261 can be read sequentially column-by-column to thedifferential amplifier 246 (FIG. 2), which subtracts the reset andintegrated charge signals and sends them to the analog-to-digitalconverter 248 (FIG. 2). Alternatively, a plurality of analog-to-digitalconverters 248 may also be provided, each digitizing sampled and heldsignals from one or more columns 249.

FIG. 4 illustrates portions of three sample and hold circuits 261 ofFIG. 3 in greater detail. Each sample and hold circuit 261 holds a setof signals, e.g., a reset signal Vrst and an integrated charge signalVsig from a desired pixel. For example, a reset signal Vrst of a desiredpixel connected to column line 170 is stored on capacitor 226 and theintegrated charge signal Vsig from column line 170 is stored oncapacitor 228. A front side of capacitor 226 is switchably coupled tothe column line 170 through switch 222 and a backside of capacitor 226is switchably coupled to amplifier 248 through switch 218. A front sideof capacitor 228 is switchably coupled to the column line 170 throughswitch 220 and a backside of capacitor 228 is switchably coupled toamplifier 248 through switch 216. The front side of capacitor 226 isswitchably coupled to the front side of capacitor 228 through crowbarswitch 239. The backside of capacitor 226 is switchably coupled to thebackside of capacitor 228 and to a reference voltage Vref source throughclamp switch 299.

Each sample and hold circuit 261 is coupled to amplifier 248 havingfirst and second inputs. The first input of amplifier 248 is coupled toa first output of amplifier 248 through a capacitor 278 and a switch 279to provide a first feedback circuit. The second input of amplifier 248is coupled to a second output of amplifier 248 through a capacitor 276and a switch 277 to provide a second feedback circuit.

The CMOS imager of FIGS. 1-4 has identical correlated double samplingand holding timing for all columns over an entire row. Thus, all of thepixels in a row are readout at substantially the same time. Thesimplified correlated double sampling and column read out timing isdepicted in FIG. 5.

Thus, to begin a readout operation, a logic high clamp signal cl isprovided to clamp switch 299 thereby coupling the backsides ofcapacitors 226, 228 to a reference voltage source Vref. When a resetsignal Vrst is read from the pixel 150, a logic high SHR signal isprovided to the gate of switch 222 thereby coupling the front side ofcapacitor 226 to the column line 170. When the readout of the resetsignal Vrst from the pixel 150 is complete, a logic low SHR signal isprovided to the gate of switch 222 thereby uncoupling the front side ofcapacitor 226 from the column line 170. Thus, a reset signal Vrst hasbeen sampled and stored on capacitor 226.

After the reset Vrst signal is read from pixel 150, an integrated chargesignal Vsig is readout. When the integrated charge signal Vsig is readfrom pixel 150, a logic high SHS signal is provided to the gate ofswitch 220 thereby coupling the front side of capacitor 228 to thecolumn line 170. When the readout of the integrated charge signal Vsigfrom the pixel 150 is complete, a logic low SHS signal is provided tothe gate of switch 220 thereby uncoupling the front side of capacitor228 from the column line 170. Thus, an integrated charge signal Vsig hasbeen sampled and stored on capacitor 228.

When the readout operation is complete, a logic low clamp signal cl isprovided to clamp switch 299 thereby uncoupling the backsides ofcapacitors 226, 228 from the reference voltage source Vref.

After a row of pixels has been readout, sampled, and held, then,generally in column order, the sample and hold circuits 261 output theirstored signals to the amplifier 248. When reading from a first sampleand hold circuit 261, a logic high control signal Φamp is provided tothe feedback circuits to close switch 279 to couple the first output ofamplifier 248 through capacitor 278 to its first input and to closeswitch 277 to couple the second output of amplifier 248 throughcapacitor 276 to its second input. A logic high crowbar control signal,e.g., crowbar1 for the sample and hold circuit 261 associated with thefirst column, is also provided to the sample and hold circuit 261 beingreadout to close the associated crowbar switch 239, thereby coupling thefront side of capacitor 226 to the front side of capacitor 228. A logichigh control signal, e.g., c1 for the sample and hold circuit 261associated with the first column, is also provided to the sample andhold circuit 261 being readout to close switch 218 and switch 216,thereby coupling the backside of capacitor 226 to the first input ofamplifier 248 and coupling the backside of capacitor 228 to the secondinput of amplifier 248.

After the reset and integrated charge signals have been readout toamplifier 248, a logic low control signal (Damp is provided to thefeedback circuits to open switch 279 and uncouple the first output ofamplifier 248 from capacitor 278 and to open switch 277 and uncouple thesecond output of amplifier 248 from capacitor 276. A logic low crowbarcontrol signal (e.g., crowbar 1 for the first column) is provided to thesample and hold 261 being readout to open the associated crowbar switch239, thereby uncoupling the front side of capacitor 226 from the frontside of capacitor 228. A logic low control signal e.g., c1, is alsoprovided to the sample and hold 261 being readout to open switch 218 andswitch 216, thereby uncoupling the backside of capacitor 226 from thefirst input of amplifier 248 and uncoupling the backside of capacitor228 from the second input of amplifier 248. Thus, a correlated doublesampled signal is provided as output from amplifier 248 resulting fromthe input of the integrated charge and reset signals to the amplifier248. After a row of sample and hold circuits 261 have been readout, anext of row of pixels 150 in the pixel array 230 are sample, held, andthen readout through the amplifier 248.

FIG. 6 illustrates a modified pixel array 230′ that uses 4-way sharedpixel circuitry comprising four pixels in neighboring columns and whichdesirably omits a row select transistor in the readout circuit for theshared pixel circuits. The pixel array 230′ is an alternative to thepixel array 230. The pixel array 230′ is comprised of even columns thatinclude pixels 450 a-d and odd columns that include pixels 451 a-d.Although pixel array 230′ is depicted as including three columns andfour rows, the pixel array 230′ is representative of a pixel arrayhaving any plurality of rows and columns. The columns of the pixel array230′ are labeled Y(m+1), Y(m), and Y−1(m+1) and the rows of pixel array230′ are labeled X(n), X(n+1), X(n+2), and X(n+3).

In array 230′ pixels are diagonally grouped by color into a pixelcircuit; thus, green pixels are grouped together and blue and red pixelsare grouped together. A green pixel circuit, for example PixelCircuit1,is comprised of pixels 451 a, 450 b, 451 c, and 450 d. The green pixelcircuit PixelCircuit1 also includes a reset transistor 484 and a sourcefollower transistor 486. A blue and red pixel circuit, for examplePixelCircuit2, is comprised of pixels 450 a, 451 b, 450 c, and 451 d.The blue and red pixel circuit PixelCircuit2 also includes a resettransistor 485 and a source follower transistor 487. In operation, thegreen pixel circuit PixelCircuit1 is readout, row by row, through asingle column line, e.g., Col Y(m+1) and the blue and red pixel circuitPixelCircuit2 is readout, row by row, through a single column line,e.g., Col Y(m). No row select transistors are used in the readoutcircuit to couple the source follower transistors 486, 487 to a columnline.

Pixel array 230′ also includes transfer transistor control linesassociated with each row of the array 230′, e.g., TX X(n) for pixels inrow X(n) associated with transfer transistors 490 a and 491 a.Additionally, pixel array 230′ includes reset transistor control linesassociated with each group of four rows of the array, e.g., RST X(n) forpixels in rows X(n), X(n+1), X(n+2), and X(n+3), associated with resettransistors 484, 485. Moreover, pixel array 230′ includes column pull up(Col_Pu) transistors 498 to control coupling a Vaa-pix voltage to acolumn line 496, 497.

FIG. 7 depicts a simplified correlated double sampling and column readout timing for the pixel array 230′ of FIG. 6. To begin a readoutoperation of a row X(n), at a time t1, a row address X(n) is provided torow addressing circuit 234 and column addressing circuit 244 of FIG. 2.A Col_Pu signal is applied to transistors 498 to couple lines 496, 497to a voltage (e.g., Vaa-pix signal level) and therefore to activate thereset transistors 484, 485. At time t2, a logic high RST signal isprovided to the reset line RST X(n), thereby placing a reset charge onone of a source or drain of reset transistors 484, 485. The floatingdiffusion regions 494, 495 are reset by this operation. At time t3, alogic low Col_Pu signal is applied to transistors 498 to turn offtransistors 498 and to deactivate reset transistors 484, 485, no longerresetting diffusion regions 494, 495. Time t3 occurs approximately250-750 ns after time t2 occurs, preferably 500 ns.

At time t4, a logic high VLN_EN control signal is provided to the gatesof column line transistors 491, 492, thereby creating a pull downcircuit on the associated column lines, e.g., 496, 497. Time t4 occurs50-100 ns after time t3, preferably 70 ns. After time t4, a logic highSHR signal is strobed to sample and hold a reset signal Vrst readout ofthe floating diffusion regions 494, 495 into sample and hold circuitry.The SHR strobe lasts approximately 1-2 μs, preferably 1.5 μs. A logichigh TX(n) then is strobed, which closes transfer transistors 491 a, 490a and couples the photodiodes 462 to their associated floating diffusionregions 494, 495, thereby transferring the accumulated charge from thephotodiode 462 to their associated floating diffusion regions 494, 495.The TX strobe lasts approximately 500-1000 ns, preferably 750 ns, endingat time t5. A logic high SHS signal is strobed to sample and holdaccumulated charge read from the floating diffusion regions 494, 495into sample and hold circuitry. The SHS signal begins to be strobedbefore the TX strobe has completed, e.g., before time t5. The strobe ofthe SHS signal lasts approximately 1-2 μs, preferably 1.5 μs and ends attime t6. At time t7, a logic low VLN_EN signal is provided thereby nolonger creating a pulldown circuit on the associated column line. Timet7 occurs approximately 50-100 ns, preferably, 70 ns, after time t6,e.g., the completion of the SHS strobe. Subsequently, a logic highCol_Pu signal and a logic low RST(n) signal are provided. Thus, a resetsignal and a charge accumulation signal are sampled from the pixel array230′.

At t8, a rolling shutter operation occurs. A row address X(n+m) isprovided to row addressing circuit 234 and column addressing circuit 244of FIG. 2, which is used for a rolling shutter. After time t8, a logichigh RST(n+m) signal and a logic high TX(n+m) are provided. The strobeof the TX(n+m) signal occurs while the RST(n+m) is provided with a logichigh signal. After the rolling shutter operation ends, e.g., at time t9,the next row of the pixel array is sampled, e.g., row n+1. The pixelarray continues to be readout, row by row, until substantially all ofthe rows of the pixel array have been readout. Thus, a reset signal anda charge accumulated signal are read out from the pixel array. Further,a rolling shutter has been toggled.

With the pixel array 230′ (FIG. 6) PixelCircuit1, PixelCircuit2, arecomprised of zigzagged pixels in two neighboring columns, so the pixelcircuits are asymmetric and are difficult to significantly reduce insize.

It is desirable to have a shared pixel circuit that is more compact andof reduced size.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a conventional imager pixel.

FIG. 2 is a block diagram of a conventional imager device.

FIG. 3 is a block diagram of a portion of an array of pixels illustratedin

FIG. 2 and an associated column readout circuit.

FIG. 4 is a conventional sample and hold circuit.

FIG. 5 is a simplified timing diagram associated with operation of thecircuitry of FIGS. 1-4.

FIG. 6 is a block diagram of a diagonally shared pixel circuit.

FIG. 7 is a simplified timing diagram associated with operation of thecircuitry of FIG. 6.

FIG. 8 is a block diagram of a vertically shared pixel circuit inaccordance with an example embodiment disclosed herein.

FIG. 9 is simplified timing diagram associated with operation of thecircuitry of FIG. 8.

FIG. 10 is a block diagram representation of a processor-based camerasystem incorporating a CMOS imaging device in accordance with anembodiment disclosed herein.

DETAILED DESCRIPTION OF THE INVENTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof, and in which is shownby way of illustration specific embodiments that may be practiced. Theseembodiments are described in sufficient detail to enable those ofordinary skill in the art to make and use them, and it is to beunderstood that structural, logical, or procedural changes may be made.

Embodiments described herein provide a shared pixel circuit which omitsa row select transistor in the readout circuit of a shared pixel andwhich reduces the size and complexity required by the shared pixel arraydepicted in FIG. 6. By providing a vertically shared (i.e., within thesame column) pixel circuit, the overall size of the pixel array can bereduced. With a pixel circuit being shared vertically instead of acrosscolumns, associated readout circuitry is less complex. Thus, pixelcircuits are symmetrical and can be reduced in size. Furthermore, thepixel circuits can also be readout quicker than the pixel circuit ofFIG. 6.

FIG. 8 illustrates a pixel array 800 comprising vertically 4-way sharedpixel circuitry, each comprising four pixels in a same column inaccordance with an example embodiment. The pixel array 800 is comprisedof even columns that include pixels 850 a-d and odd columns that includepixels 851 a-d. Although pixel array 800 is depicted as including threecolumns and four rows, the pixel array 800 is representative of a pixelarray having any plurality of rows and columns. The columns of the pixelarray 800 are labeled Y(m+1), Y(m), and Y−1(m+1) and the rows of pixelarray 800 are labeled X(n), X(n+1), X(n+2), and X(n+3).

In illustrated embodiment, pixels are vertically grouped by column intoa shared pixel circuit; thus, four pixels in a column are groupedtogether. A first shared pixel circuit, for example PixelCircuit1′, iscomprised of pixels 850 a, 850 b, 850 c, and 850 d. The first pixelcircuit PixelCircuit1′ also includes a reset transistor 884 and a sourcefollower transistor 896. PixelCircuit1′ does not include a row selecttransistor. A second shared pixel circuit, for example PixelCircuit2′,is comprised of pixels 851 a, 851 b, 851 c, and 851 d. The second pixelcircuit PixelCircuit2′ also includes a reset transistor 885 and a sourcefollower transistor 897 and does not include a row select transistor.

Each shared pixel circuit, e.g., PixelCircuit1′ has a plurality ofpixels, and at least two of the plurality of pixels are of a same color.For example, as depicted in FIG. 8, PixelCircuit1′ includes two greenpixels 850 b, 850 d. Additionally, PixelCircuit1′ includes two pixels ofa second same color, e.g., pixels 850 a, 850 c are red. Similarly,PixelCircuit2′ includes two green pixels 851 a, 851 c and two bluepixels 851 b, 851 d. All of the plurality of pixels of the shared pixelcircuit are in a same column of pixels. For example, the pixels ofPixelCircuit1′ are all in column Y(m+1). Each column of pixels in array230′ includes a plurality of pixel circuits.

In an aspect, the pixel array 800 includes a plurality of ground (GND)lines that run in a vertical direction of the array. These ground linesare connected throughout the array 800 at various locations to a groundsource. Including a plurality of GND lines that are relatively locallyconnected to a ground source reduces noise. Pixel array 800 includescolumn pull up (Col_Pu) transistors 498 to control coupling a Vaa-pixvoltage to a column line 488, 489.

FIG. 9 depicts a simplified correlated double sampling and column readout timing for the pixel array 800 of FIG. 8. To begin a readoutoperation of a row X(n), at a time t′1, a row address X(n) is providedto row addressing circuit 234 and column addressing circuit 244 FIG. 2.At time t′2, a logic high RST signal is provided to the reset line RSTX(n), thereby placing a charge on one of a source or drain of resettransistors 884, 885. The floating diffusion regions 494, 495 are reset.At time t′3, a logic high Col_PU signal is provided to transistors 498thereby coupling the lines 488, 489 to a voltage, e.g., Vaa_pix voltagelevel and enabling diffusion regions 494, 495 to be reset (via the resettransistors 884, 885). In an aspect, time t′3 occurs approximately250-750 ns after time t′2 occurs, preferably 500 ns. Before time t′4occurs, a logic low Col_Pu signal is provided to transistors 498 therebyuncoupling the lines 488, 489 from the voltage, e.g., Vaa_pix voltagelevel, and disabling diffusion regions 494, 495 from being furtherreset.

At time t′4, a logic high VLN_EN control signal is provided to the gatesof transistors 491, 492 thereby creating a pull down circuit on theassociated column lines, e.g., 488, 489. In one aspect, time t′4 occursapproximately 50-100 ns after time t3, preferably 70 ns. After time t′4,a logic high SHR signal is strobed to sample and hold a reset signalread from the floating diffusion regions 494, 495 into a sample and holdcircuit. In an aspect, the SHR strobe lasts approximately 1-2 μs,preferably 1.5 μs. A logic high TX(n) is strobed which closes transfertransistors 891 a, 890 a and couples the photodiodes 462 to theirassociated floating diffusion regions 494, 495 transferring theaccumulated charge from the photodiodes 462 to their associated floatingdiffusion regions 494, 495. In an aspect the TX(n) strobe lastsapproximately 50-100 ns, preferably 70 ns, and ends at time t′S. A logichigh SHS signal is strobed to sample and hold the accumulated chargeread from the floating diffusion regions 494, 495 into a sample and holdcircuit. In a preferred approach, the SHS signal begins to be strobedbefore time t′S, e.g., before the TX(n) strobe has completed. In anaspect, the strobe of the SHS signal lasts approximately 1-2 μs,preferably 1.5 μs, and ends at time t′6. At time t′7, a logic low VLN_ENis provided thereby no longer creating a pulldown circuit on theassociated column line. In an aspect time t′7 occurs approximately50-100 ns, preferably, 70 ns, after the completion of the SHS strobe.Subsequently, a logic low RST(n) signal is provided. Thus, a resetsignal and a charge accumulation signal are sampled from the pixelarray. After that, the Col_Pu is enabled with RST(n) at low to reset thefloating diffusion regions 494, 495 to a low potential, which turns offthe source follower transistor on the nth row.

At time t′8, a rolling shutter operation begins. A row address X(n+m) isprovided to row addressing circuit 234 and column addressing circuit 244(FIG. 2), which is used to implement a rolling shutter. After time t′8,the logic high RST(n+m) signal and a logic high TX(n+m) are provided toreset the floating diffusion regions 494, 495 and photodiodes 462 to ahigh potential and fully deplete the photodiodes 462. In an aspect, thestrobe of the TX(n+m) signal occurs while the RST(n+m) is provided witha logic high signal; the Col_Pu is high and keeps the RST (n+m) at lowto turn off the source follower on the (n+m)th row. After an initialaspect of the rolling shutter operation ends at time t′9, the next rowof the pixel array is sampled, e.g., row n+1. As conventionally known,the pixel array continues to be readout, row by row, until substantiallyall of the rows of the pixel array have been readout.

FIG. 10 is a block diagram representation of processor system that mayinclude imaging device 1101 having the pixel array 800 (FIG. 8) andassociated readout circuitry as described with respect to the variousembodiments described herein. The processor system could, for example,be a camera system 1190. A camera system 1190 generally comprises ashutter release button 1192, a view finder 1196, a flash 1198 and a lenssystem 1194 for focusing an image on the pixel array 800 of imagingdevice 1101. A camera system 1190 generally also comprises a centralprocessing unit (CPU) 1110, for example, a microprocessor forcontrolling camera functions which communicates with one or moreinput/output devices (I/O) 1150 over a bus 1170. The CPU 1110 alsoexchanges data with random access memory (RAM) 1160 over bus 1170,typically through a memory controller. The camera system 1190 may alsoinclude peripheral devices such as a removable memory 1130, which alsocommunicates with CPU 1110 over the bus 1170. Imager device 1101 iscoupled to the processor system and includes a pixel array 800 asdescribed along with respect to FIGS. 8-9. Other processor systems whichmay employ imaging devices 800 besides cameras, including computers,PDAs, cellular telephones, scanners, machine vision systems, and othersystems requiring an imager operation.

While the embodiments have been described and illustrated with referenceto specific example embodiments, it should be understood that manymodifications and substitutions can be made. Although the embodimentsdiscussed above describe specific numbers of transistors, photodiodes,conductive lines, etc., they are not so limited. For example, the aboveembodiments are not limited to vertical (single column) with internalreset and no row select of a 4 way shared pixel and could be applied to2 way shared, 3 way shared, 5 way shared, etc. Accordingly, the claimedinvention is not to be considered as limited by the foregoingdescription but is only limited by the scope of the claims.

1-10. (canceled)
 11. A method of reading from a pixel circuit comprisinga plurality of 4-way shared pixels in a column of a pixel array whereeach pixel circuit has a plurality of different colored pixels, saidmethod comprising: applying a logic high signal on a reset control lineto turn on a reset transistor, the reset transistor, when turned on,causing a reset voltage to be applied on a column line; applying a logiclow signal on the reset control signal to turn off the reset transistor;applying a logic high signal to enable readout of the column line;reading out a pixel reset signal from the pixel circuit; and reading outa pixel image signal from the pixel circuit.
 12. The method of claim 11,wherein said step of reading out the pixel reset signal furthercomprises: applying a logic high pulse on a sample and hold reset signalcontrol line.
 13. The method of claim 12, wherein said step of readingout the pixel reset signal further comprises: applying a logic highpulse on a transfer control line after the step of applying a logic highpulse on the sample and hold reset signal control line.
 14. The methodof reading from a pixel circuit of claim 13, wherein said step ofreading out the pixel image signal further comprises: applying a logichigh pulse on a sample and hold signal control line after the step ofapplying a logic high pulse on the transfer control line. 15-24.(canceled)
 25. A method of reading from a pixel circuit comprising aplurality of at least four pixels in a first column of a pixel array,each pixel including a photosensor and commonly electrically coupled toa storage region, said method comprising: turning on a reset transistorcommon to all of the plurality of at least four pixels, causing a resetvoltage to be applied on a column line of the first column; turning offthe reset transistor; enabling the column line for readout; reading outthe reset voltage from the pixel circuit; and reading out a pixel imagesignal from the pixel circuit.
 26. The method of claim 25, furthercomprising using a sample and hold circuitry to sample and hold thereset voltage from the pixel circuit.
 27. The method of claim 26,further comprising, after the reset voltage is read from the pixelcircuit, transferring accumulated charge from the photosensors to thestorage region.
 28. The method of claim 27, further comprising using asample and hold circuitry to sample and hold the accumulated charge fromthe photosensors.